After reflow, carefully remove substrate with components and allow to cool.
回流后, 仔細(xì)拿開(kāi)帶組件的基板,并使之冷卻.
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Reflow solder paste in 2 hours as soon as possible after printing.
印刷后要在2小時(shí)內(nèi)回流焊膏.
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Compatible with infrared and vapor phase reflow solder process.
適用于回流焊接工藝.
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Good management for reflow and wave profile and profile board.
良好的管理為回流焊和波峰焊溫度曲線及溫度曲線量測(cè)板.
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The reflow process relies on the temperature profile setting.
回流過(guò)程依賴于溫度曲線的設(shè)定.
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A potential reflow method - laser reflow soldering was expatiated in detail.
著重闡述了一種極具潛力的再流焊方法 ——— 激光再流焊.
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The most obvious is the necessity for increased reflow temperature.
最明顯的是,使用無(wú)鉛錫膏必須提高回流焊溫度.
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Adapted to the reflow soldering.
適應(yīng)于回流焊接.
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Hand solder is recommended instead of reflow solder.
不建議使用回流焊,推薦使用手動(dòng)焊接.
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Suitable for flow and reflow soldering.
適合一般焊接及回焊.
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Do not inhale the vapor during reflow.
不要吸入回流焊時(shí)噴出的蒸氣.
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Suit for reflow and wave flow solder.
適應(yīng)再流焊與波峰焊.
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Clear how to measuring reflow and wave profile.
清楚怎樣測(cè)量回流焊和波峰焊溫度曲線.
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Suitable for SMT craft reflow soldering.
適用于回流焊SMT工藝.
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Delamination caused by electrical - over - stress ( EOS ) and moisture expansion during reflow soldering have shown different delamination patterns.
由過(guò)電應(yīng)力 ( EOS ) 和再流焊中的水汽膨脹引起的分層會(huì)顯示出不同的失效模式.
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