Interfacial tractions at the broken ends will produce delamination.
斷頭處的界面引力將引起分層.
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The additional state of axisymmetric delamination problem of sandwich plates is studied.
研究了夾芯板軸對稱脫層問題的附加狀態(tài).
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A refined delamination model for laminated composite beams is presented.
建立了一種精化的復(fù)合材料層合梁脫層模型.
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Mechanisms of delamination, void defects in electroless plating and nonuniformity in electroplate were introduced.
重點(diǎn)介紹了鉆孔中分層 、 化學(xué)鍍銅中的氣泡缺陷、電鍍中的鍍層不均勻等缺陷產(chǎn)生的機(jī)理.
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Minimum adhesive strength build up ensures easy peeling without adhesive migration and delamination.
低逐加粘合度可確保易于剝離而不會產(chǎn)生溢膠和分離.
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In composite laminates there are four basic failure modes: matrix cracking, delamination, fiber breakage and debonding.
復(fù)合材料層合板中存在四種基本的失效模式,即: 基體開裂 、 分層 、 纖維斷裂及脫粘.
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This model has a good reusability and expansibility by Standardizing interfaces and internal delamination.
通過規(guī)范接口與內(nèi)部分層,使得該模塊具有良好的可重用性和可擴(kuò)展性.
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The main wear mechanisms of the coating are abrasive wear and delamination wear.
涂層的磨損機(jī)制主要是磨粒磨損和剝層磨損.
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Delamination caused by electrical - over - stress ( EOS ) and moisture expansion during reflow soldering have shown different delamination patterns.
由過電應(yīng)力 ( EOS ) 和再流焊中的水汽膨脹引起的分層會顯示出不同的失效模式.
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These inner and outer factors cause interface delamination, which is more serious in the density package.
這些內(nèi)部和外部的因素直接導(dǎo)致了高密度芯片封裝中粘結(jié)膜界面分層現(xiàn)象日趨嚴(yán)重.
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When the parallel and vertical cracks encountered plate - like particles detached by delamination mechanism.
平行和垂向裂紋相遇,導(dǎo)致片狀顆粒按剝層機(jī)制脫落.
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By the global - local method, the delamination study was implemented from mm scale to um scale.
通過“全局 - 局部”模擬方法, 將各向異性導(dǎo)電膜的界面分層研究從毫米級深入到亞微米級.
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The results show that main failure types of PDC well bits are gross fracturing and delamination.
結(jié)果表明,PDC鉆頭 切削齒的微斷屑、宏觀破裂及剝離失效形式是造成PDC鉆頭早期失效的主要形式和原因.
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Most wave energy propagates only in the composite plates up and below the delamination.
并且波的能量大部分在脫層處的上、下復(fù)合材料板中來回傳播,被反射和透射出的能量很少.
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